Sunbeam Electronics (Hong Kong) Limited
Intergrate multi-products, full stages service, High quality control , Customer requirement fullfillment
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| EU RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| Automotive | No |
| PPAP | No |
| Product Category | Power MOSFET |
| Material | Si |
| Configuration | Single Quad Drain Triple Source |
| Process Technology | HEXFET |
| Channel Mode | Enhancement |
| Channel Type | P |
| Number of Elements per Chip | 1 |
| Maximum Drain Source Voltage (V) | 30 |
| Maximum Gate Source Voltage (V) | ±20 |
| Maximum Continuous Drain Current (A) | 21 |
| Maximum Drain Source Resistance (MOhm) | 4.6@10V |
| Typical Gate Charge @ Vgs (nC) | 58@4.5V|110@10V |
| Typical Gate Charge @ 10V (nC) | 110 |
| Typical Input Capacitance @ Vds (pF) | 5250@15V |
| Maximum Power Dissipation (mW) | 3100 |
| Typical Fall Time (ns) | 70 |
| Typical Rise Time (ns) | 47 |
| Typical Turn-Off Delay Time (ns) | 65 |
| Typical Turn-On Delay Time (ns) | 25 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Temperature (°C) | 150 |
| Packaging | Tape and Reel |
| Pin Count | 8 |
| Standard Package Name | QFN |
| Supplier Package | PQFN EP |
| Mounting | Surface Mount |
| Package Height | 0.95(Max) |
| Package Length | 5 |
| Package Width | 6 |
| PCB changed | 8 |
| Lead Shape | No Lead |