GD25LQ64CWIGR Gigadevice Dual And Quad Spi Flash Memory 133 MHz

GD25LQ64CWIGR Gigadevice Dual and Quad Serial Flash

• Manufacturer Part Number:

  GD25LQ64CWIGR

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Contact Manufacturer

• Package Description:

  WSON-8

• Reach Compliance Code:

  unknown

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.51

• Manufacturer:

  GigaDevice Semiconductor (Beijing) Inc

• Risk Rank:

  5.45

• Clock Frequency-Max (fCLK):

  133 MHz

• JESD-30 Code:

  R-PDSO-N8

• Length:

  6 mm

• Memory Density:

  67108864 bit

• Memory IC Type:

  FLASH

• Memory Width:

  1

• Number of Functions:

  1

• Number of Terminals:

  8

• Number of Words:

  67108864 words

• Number of Words Code:

  64000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  64MX1

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  HVSON

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

• Parallel/Serial:

  SERIAL

• Peak Reflow Temperature (Cel):

  NOT SPECIFIED

• Programming Voltage:

  1.8 V

• Seated Height-Max:

  0.8 mm

• Supply Voltage-Max (Vsup):

  2 V

• Supply Voltage-Min (Vsup):

  1.65 V

• Supply Voltage-Nom (Vsup):

  1.8 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Form:

  NO LEAD

• Terminal Pitch:

  1.27 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  NOT SPECIFIED

• Type:

  NOR TYPE

• Width:

  5 mm